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 IS61LV632A
32K x 32 SYNCHRONOUS FAST STATIC RAM
FEATURES
* Fast access time: - 4 ns-125 MHz; 5 ns-100 MHz; 6 ns-83 MHz; 7 ns-75 MHz; 8 ns-66 MHz * Internal self-timed write cycle * Individual Byte Write Control and Global Write * Clock controlled, registered address, data and control * PentiumTM or linear burst sequence control using MODE input * Three chip enables for simple depth expansion and address pipelining * Common data inputs and data outputs * Power-down control by ZZ input * JEDEC 100-Pin TQFP and PQFP package * 3.3V Vcc and 2.5V VCCQ for 2.5V I/Os * Two Clock enables and one Clock disable to eliminate multiple bank bus contention. * Control pins mode upon power-up: - MODE in interleave burst mode - ZZ in normal operation mode These control pins can be connected to GNDQ or VCCQ to alter their power-up state
ISSI
(R)
APRIL 2001
DESCRIPTION The ISSI IS61LV632A is a high-speed, low-power synchronous static RAM designed to provide a burstable, highperformance, secondary cache for the i486TM, PentiumTM, 680X0TM, and PowerPCTM microprocessors. It is organized as 32,768 words by 32 bits, fabricated with ISSI's advanced CMOS technology. The device integrates a 2-bit burst counter, high-speed SRAM core, and high-drive capability outputs into a single monolithic circuit. All synchronous inputs pass through registers controlled by a positive-edge-triggered single clock input. Write cycles are internally self-timed and are initiated by the rising edge of the clock input. Write cycles can be from one to four bytes wide as controlled by the write control inputs. Separate byte enables allow individual bytes to be written. BW1 controls DQ1-DQ8, BW2 controls DQ9-DQ16, BW3 controls DQ17-DQ24, BW4 controls DQ25-DQ32, conditioned by BWE being LOW. A LOW on GW input would cause all bytes to be written. Bursts can be initiated with either ADSP (Address Status Processor) or ADSC (Address Status Cache Controller) input pins. Subsequent burst addresses can be generated internally by the IS61LV632A and controlled by the ADV (burst address advance) input pin. Asynchronous signals include output enable (OE), sleep mode input (ZZ), clock (CLK) and burst mode input (MODE). A HIGH input on the ZZ pin puts the SRAM in the power-down state. When ZZ is pulled LOW (or no connect), the SRAM normally operates after three cycles of the wake-up period. A LOW input, i.e., GNDQ, on MODE pin selects LINEAR Burst. A VCCQ (or no connect) on MODE pin selects INTERLEAVED Burst.
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. (c) Copyright 2001, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
1
IS61LV632A
BLOCK DIAGRAM
MODE Q0 A0'
ISSI
CLK A0
(R)
CLK
BINARY COUNTER
ADV ADSC ADSP CE CLR Q1 A1' A1
32K x 32 MEMORY ARRAY
13 15
A14-A0
15
D
Q
ADDRESS REGISTER
CE CLK 32 32
GW BWE BW4
D
Q
DQ32-DQ25 BYTE WRITE REGISTERS
CLK
D BW3
Q
DQ24-DQ17 BYTE WRITE REGISTERS
CLK
D BW2
Q
DQ16-DQ9 BYTE WRITE REGISTERS
CLK
D BW1
Q
DQ8-DQ1 BYTE WRITE REGISTERS
CLK
CE1 CE2 CE3 D Q
4
ENABLE REGISTER
CE CLK
INPUT REGISTERS
CLK
OUTPUT REGISTERS
CLK OE
32 DATA[32:1]
D
Q
ENABLE DELAY REGISTER
CLK
OE
2
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61LV632A
PIN CONFIGURATION
100-Pin TQFP and PQFP (Top View)
A6 A7 CE1 CE2 BW4 BW3 BW2 BW1 CE3 VCC GND CLK GW BWE OE ADSC ADSP ADV A8 A9
ISSI
(R)
NC DQ17 DQ18 VCCQ GNDQ DQ19 DQ20 DQ21 DQ22 GNDQ VCCQ DQ23 DQ24 NC VCC NC GND DQ25 DQ26 VCCQ GNDQ DQ27 DQ28 DQ29 DQ30 GNDQ VCCQ DQ31 DQ32 NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 1 79 2 78 3 77 4 76 5 75 6 74 7 73 8 72 9 71 10 70 11 69 12 68 13 67 14 66 15 65 16 64 17 63 18 62 19 61 20 60 21 59 22 58 23 57 24 56 25 55 26 54 27 53 28 52 29 51 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
NC DQ16 DQ15 VCCQ GNDQ DQ14 DQ13 DQ12 DQ11 GNDQ VCCQ DQ10 DQ9 GND NC VCC ZZ DQ8 DQ7 VCCQ GNDQ DQ6 DQ5 DQ4 DQ3 GNDQ VCCQ DQ2 DQ1 NC
PIN DESCRIPTIONS
A0-A14 CLK ADSP ADSC ADV BW1-BW4 BWE GW CE1, CE2, CE3 Address Inputs Clock Processor Address Status Controller Address Status Burst Address Advance Synchronous Byte Write Enable Byte Write Enable Global Write Enable Synchronous Chip Enable GNDQ OE DQ1-DQ32 ZZ MODE VCC GND VCCQ Output Enable Data Input/Output Sleep Mode Burst Sequence Mode +3.3V Power Supply Ground Isolated Output Buffer Supply: +2.5V Isolated Output Buffer Ground
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
MODE A5 A4 A3 A2 A1 A0 NC NC GND VCC NC NC A10 A11 A12 A13 A14 NC NC
3
IS61LV632A
TRUTH TABLE
OPERATION Deselected, Power-down Deselected, Power-down Deselected, Power-down Deselected, Power-down Deselected, Power-down Read Cycle, Begin Burst Read Cycle, Begin Burst Write Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Write Cycle, Suspend Burst Write Cycle, Suspend Burst ADDRESS USED None None None None None External External External External External Next Next Next Next Next Next Current Current Current Current Current Current CE1 H L L L L L L L L L X X H H X H X X H H X H CE2 X L X L X H H H H H X X X X X X X X X X X X CE3 X X H X H L L L L L X X X X X X X X X X X X ADSP ADSC X L L H H L L H H H H H X X H X H H X X H X L X X L L X X L L L H H H H H H H H H H H H ADV X X X X X X X X X X L L L L L L H H H H H H WRITE X X X X X X X L H H H H H H L L H H H H L L
ISSI
OE X X X X X L H X L H L H L H X X L H L H X X DQ High-Z High-Z High-Z High-Z High-Z Q High-Z D Q High-Z Q High-Z Q High-Z D D Q High-Z Q High-Z D D
(R)
Notes: 1. All inputs except OE must meet setup and hold times for the Low-to-High transition of clock (CLK). 2. Wait states are inserted by suspending burst. 3. X means don't care. WRITE=L means any one or more byte write enable signals (BW1-BW4) and BWE are LOW or GW is LOW. WRITE=H means all byte write enable signals are HIGH. 4. For a Write operation following a Read operation, OE must be HIGH before the input data required setup time and held HIGH throughout the input data hold time. 5. ADSP LOW always initiates an internal READ at the Low-to-High edge of clock. A WRITE is performed by setting one or more byte write enable signals and BWE LOW or GW LOW for the subsequent L-H edge of clock.
PARTIAL TRUTH TABLE
FUNCTION READ READ WRITE Byte 1 WRITE All Bytes WRITE All Bytes GW H H H X L BWE H X L L X BW1 X H L L X BW2 X H H L X BW3 X H H L X BW4 X H H L X
4
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61LV632A
INTERLEAVED BURST ADDRESS TABLE (MODE = VCCQ or No Connect)
External Address A1 A0 00 01 10 11 1st Burst Address A1 A0 01 00 11 10 2nd Burst Address A1 A0 10 11 00 01 3rd Burst Address A1 A0 11 10 01 00
ISSI
(R)
LINEAR BURST ADDRESS TABLE (MODE = GNDQ)
0,0
A1', A0' = 1,1
0,1
1,0
ABSOLUTE MAXIMUM RATINGS(1)
Symbol TBIAS TSTG PD IOUT VIN, VOUT VIN Parameter Temperature Under Bias Storage Temperature Power Dissipation Output Current (per I/O) Voltage Relative to GND for I/O Pins Voltage Relative to GND for for Address and Control Inputs Value Unit -10 to +85 C -55 to +150 C 1.8 W 100 mA -0.5 to VCCQ + 0.3 V -0.5 to 4.6 V
Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. This device contains circuity to protect the inputs against damage due to high static voltages or electric fields; however, precautions may be taken to avoid application of any voltage higher than maximum rated voltages to this high-impedance circuit. 3. This device contains circuitry that will ensure the output devices are in High-Z at power up.
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
5
IS61LV632A
OPERATING RANGE
Range Commercial Industrial Ambient Temperature 0C to +70C -40C to +85C VCC 3.3V 5% 3.3V 5% VCCQ 2.375V min., 3.465V max. 2.375V min., 3.465V max.
ISSI
(R)
DC ELECTRICAL CHARACTERISTICS(1) (Over Operating Range)
Symbol Parameter VOH VOL VIH VIL ILI ILO Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Leakage Current Output Leakage Current GND - VIN - VCCQ(2) GND - VOUT - VCCQ, OE = VIH Com. Ind. Com. Ind. Test Conditions IOH = -1.0 mA IOL = 1.0 mA Min. 2.0 -- 1.7 -0.3 -5 -10 -5 -10 Max. -- 0.4 VCCQ + 0.3 0.7 5 10 5 10 Unit V V V V A A
POWER SUPPLY CHARACTERISTICS (Over Operating Range)
Sym. Parameter ICC AC Operating Supply Current Test Conditions Device Selected, All Inputs = VIL or VIH OE = VIH, Cycle Time * tKC min. Device Deselected, VCC = Max., All Inputs = VIH or VIL CLK Cycle Time * tKC min. Com. Ind. 4 Typ. Max. 150 180 ---- 5 Typ. Max. 140 170 ---- 6 Typ. Max. 130 160 140 170 7 Typ. Max. 120 150 130 160 8 Typ. Max. 110 140 120 150 Unit mA mA
ISB
Standby Current
Com. Ind.
15 --
45 --
15 --
45 --
15 20
45 50
15 20
45 50
15 20
45 50
mA mA
IZZ
Power-Down Mode ZZ = VCCQ, CLK Running Current All Inputs - GND + 0.2V or * VCC - 0.2V
Com. Ind.
1 --
10 --
1 --
10 --
1 2
10 20
1 2
10 20
1 2
10 20
mA mA
Note: 1. MODE pin has an internal pull-up. ZZ pin has an internal pull-down. These pins may be a No Connect, tied to GND, or tied to VCCQ. 2. MODE pin should be tied to Vcc or GND. It exhibits 10 A maximum leakage current when tied to - GND + 0.2V or * Vcc - 0.2V.
6
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61LV632A
CAPACITANCE(1,2)
Symbol CIN COUT Parameter Input Capacitance Input/Output Capacitance Conditions VIN = 0V VOUT = 0V Max. 6 8 Unit pF pF
ISSI
(R)
Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: TA = 25C, f = 1 MHz, Vcc = 3.3V.
AC TEST CONDITIONS
Parameter Input Pulse Level for I/O Pins Input Pulse Level for Input Pins Input Rise and Fall Times Input and Output Timing and Reference Level Output Load Unit 0V to 2.5V 0V to 3.0V 1.5 ns 1.25V See Figures 1 and 2
AC TEST LOADS
317 2.5V
ZO = 50
OUTPUT
Output Buffer
30 pF
50
1.25V
5 pF Including jig and scope
351
Figure 1
Figure 2
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
7
IS61LV632A
READ CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-4
ISSI
Min. Max. 8 4 4 -- 1.5 0 1.5 -- 0 0 -- 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 35 -- -- -- 4 -- -- 4 4 -- -- 4.5 -- -- -- -- -- -- -- -- -- -- -- -5 Min. Max. 10 4 4 -- 1.5 0 1.5 -- 0 0 -- 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 35 -- -- -- 5 -- -- 5 5 -- -- 4.8 -- -- -- -- -- -- -- -- -- -- -- -6 Min. Max. 12 4 4 -- 2 0 2 -- 0 0 -- 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 45 -- -- -- 6 -- -- 6 6 -- -- 6 -- -- -- -- -- -- -- -- -- -- -- -7 Min. Max. 13 6 6 -- 2 0 2 -- 0 0 -- 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 66.7 -- -- -- 7 -- -- 6 6 -- -- 6 -- -- -- -- -- -- -- -- -- -- -- -8 Min. Max. 15 6 6 -- 2 0 2 -- 0 0 -- 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 80 -- -- -- 8 -- -- 6 6 -- -- 6 -- -- -- -- -- -- -- -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
(R)
Symbol tKC tKH tKL tKQ tKQX
(2)
Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Write Setup Time Address Advance Setup Time Address Hold Time Address Status Hold Time Write Hold Time Chip Enable Hold Time Address Advance Hold Time Configuration Setup(1)
tKQLZ(2,3) tKQHZ(2,3) tOEQ tOEQX(2) tOELZ(2,3) tOEHZ(2,3) tAS tSS tWS tCES tAVS tAH tSH tWH tCEH tAVH tCFG
Chip Enable Setup Time 2.5
Notes: 1. Configuration signal MODE is static and must not change during normal operation. 2. Guaranteed but not 100% tested. This parameter is periodically sampled. 3. Tested with the load in Figure 2.
8
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61LV632A
READ CYCLE TIMING
tKC
ISSI
tSH tKH tKL
(R)
CLK
tSS
ADSP is blocked by CE1 inactive
ADSP
tSS tSH
ADSC initiate read
ADSC
tAVS tAVH
Suspend Burst
ADV
tAS tAH
A14-A0
RD1
tWS tWH
RD2
RD3
GW
tWS tWH
BWE
BW4-BW1
tCES tCEH
CE1 Masks ADSP
CE1
tCES tCEH
CE2 and CE3 only sampled with ADSP or ADSC
Unselected with CE2
CE2
tCES tCEH
CE3
tOEQ tOEHZ
OE
tOELZ tOEQX tKQX
DATAOUT
High-Z
tKQLZ tKQ
1a
2a
2b
2c
2d
3a
tKQHZ
DATAIN
High-Z Pipelined Read Single Read Burst Read Unselected
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
9
IS61LV632A
WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-4
ISSI
Min. Max. 8 4 4 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 25 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -5 Min. Max. 10 4 4 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 35 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -6 Min. Max. 12 4 4 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 45 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -7 Min. Max. 13 6 6 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 52 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -8 Min. Max. 15 6 6 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 60 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
(R)
Symbol tKC tKH tKL tAS tSS tWS tDS tCES tAVS tAH tSH tDH tWH tCEH tAVH tCFG
Parameter Cycle Time Clock High Time Clock Low Time Address Setup Time Address Status Setup Time Write Setup Time Data In Setup Time Address Advance Setup Time Address Hold Time Address Status Hold Time Data In Hold Time Write Hold Time Chip Enable Hold Time Address Advance Hold Time Configuration Setup(1)
Chip Enable Setup Time 2.5
Notes: 1. Configuration signal MODE is static and must not change during normal operation.
10
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61LV632A
WRITE CYCLE TIMING
tKC
ISSI
tSH tKH tKL
(R)
CLK
tSS
ADSP is blocked by CE1 inactive
ADSP ADSC initiate Write ADSC ADV must be inactive for ADSP Write tAVS ADV
tAS tAH tAVH
A14-A0
WR1
tWS tWH
WR2
WR3
GW
tWS tWH
BWE
tWS tWH tWS tWH
BW4-BW1
tCES tCEH
WR1
WR2 CE1 Masks ADSP
WR3
CE1
tCES tCEH
CE2 and CE3 only sampled with ADSP or ADSC
Unselected with CE2
CE2
tCES tCEH
CE3
OE
DATAOUT
High-Z
tDS tDH
BW4-BW1 only are applied to first cycle of WR2 2a 2b 2c 2d 3a
DATAIN
High-Z
1a
Single Write
Burst Write
Write
Unselected
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
11
IS61LV632A
READ/WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-4
ISSI
Min. Max. 8 4 4 -- 1.5 0 1.5 -- 0 0 -- 2.5 2.5 2.5 0.5 0.5 0.5 0.5 25 -- -- -- 4 -- -- 4 4.5 -- -- 4.5 -- -- -- -- -- -- -- -- -- -5 Min. Max. 10 4 4 -- 1.5 0 1.5 -- 0 0 -- 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 35 -- -- -- 5 -- -- 5 4.8 -- -- 4.8 -- -- -- -- -- -- -- -- -- -6 Min. Max. 12 4 4 -- 1.5 0 1.5 -- 0 0 -- 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 45 -- -- -- 6 -- -- 5 6 -- -- 6 -- -- -- -- -- -- -- -- -- -7 Min. Max. 13 6 6 -- 2 0 2 -- 0 0 -- 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 52 -- -- -- 7 -- -- 6 6 -- -- 6 -- -- -- -- -- -- -- -- -- -8 Min. Max. 15 6 6 -- 2 0 2 -- ns ns -- 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 60 6 -- -- -- -- -- -- -- -- -- ns ns ns ns ns ns ns ns ns ns -- -- -- 8 -- -- 6 6 Unit ns ns ns ns ns ns ns ns
(R)
Symbol tKC tKH tKL tKQ tKQX
(2)
Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Write Setup Time Address Hold Time Address Status Hold Time Write Hold Time Chip Enable Hold Time Configuration Setup(1)
tKQLZ(2,3) tKQHZ(2,3) tOEQ tOEQX(2) tOELZ(2,3) tOEHZ(2,3) tAS tSS tWS tCES tAH tSH tWH tCEH tCFG
Chip Enable Setup Time 2.5
Notes: 1. Configuration signal MODE is static and must not change during normal operation. 2. Guaranteed but not 100% tested. This parameter is periodically sampled. 3. Tested with the load in Figure 2.
12
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61LV632A
READ/WRITE CYCLE TIMING
tKC
ISSI
tSH tKH tKL
(R)
CLK
tSS
ADSP is blocked by CE1 inactive
ADSP
tSS tSH
ADSC
ADV
tAS tAH
A14-A0
RD1
tWS tWH
WR1
RD2
RD3
GW
tWS tWH
BWE
tWS tWH
BW4-BW1
tCES tCEH
WR1 CE1 Masks ADSP
CE1
tCES tCEH
CE2 and CE3 only sampled with ADSP or ADSC
CE2
tCES tCEH
Unselected with CE3
CE3
tOEQ tOEHZ
OE
tOELZ tOEQX tKQX
DATAOUT
High-Z
tKQLZ tKQ
1a
tKQX tKQHZ
2a
2b
2c
2d
tKQHZ
DATAIN
High-Z
tDS
1a
tDH
Single Read
Single Write
Burst Read
Unselected
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
13
IS61LV632A
ISSI
-4
(R)
SNOOZE AND RECOVERY CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
Symbol tKC tKH tKL tKQ tKQX
(4)
Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Address Hold Time Address Status Hold Time Chip Enable Hold Time ZZ Standby
(1)
Min. Max. 8 4 4 -- 1.5 0 1.5 -- 0 0 -- 2.5 2.5 -- -- -- 4 -- -- 4 4.5 -- -- 4.5 -- -- -- -- -- -- -- -- --
-5 Min. Max. 10 4 4 -- 1.5 0 1.5 -- 0 0 -- 2.5 2.5 2.5 0.5 0.5 0.5 2 2 35 -- -- -- 5 -- -- 5 5 -- -- 4.8 -- -- -- -- -- -- -- -- --
-6 Min. Max. 12 4 4 -- 2 0 1.5 -- 0 0 -- 2.5 2.5 2.5 0.5 0.5 0.5 2 2 45 -- -- -- 6 -- -- 6 6 -- -- 6 -- -- -- -- -- -- -- -- --
-7 Min. Max. 13 6 6 -- 2 0 2 -- 0 0 -- 2.5 2.5 2.5 0.5 0.5 0.5 2 2 52 -- -- -- 7 -- -- 6 6 -- -- 6 -- -- -- -- -- -- -- -- --
-8 Min. Max. 15 6 6 -- 2 0 2 -- 0 0 -- 2.5 2.5 2.5 0.5 0.5 0.5 2 2 60 -- -- -- 8 -- -- 6 6 -- -- 6 -- -- -- -- -- -- -- -- --
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns cyc cyc ns
tKQLZ(4,5) tKQHZ(4,5) tOEQ tOEQX(4) tOELZ(4,5) tOEHZ(4,5) tAS tSS tCES tAH tSH tCEH tZZS tZZREC tCFG
Chip Enable Setup Time 2.5 0.5 0.5 0.5 2 2 25
ZZ Recovery(2) Configuration Setup(3)
Notes: 1. The assertion of ZZ allows the SRAM to enter a lower power state than when deselected within the time specified. Data retention is guaranteed when ZZ is asserted and clock remains active. 2. ADSC and ADSP must not be asserted for at least 2 cyc after leaving ZZ state. 3. Configuration signal MODE is static and must not change during normal operation. 4. Guaranteed but not 100% tested. This parameter is periodically sampled. 5. Tested with load in Figure 2.
14
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61LV632A
SNOOZE AND RECOVERY CYCLE TIMING
tKC
ISSI
tSS tSH tKH tKL
(R)
CLK
ADSP
ADSC
ADV
tAS tAH
A14-A0
RD1
RD2
GW
BWE
BW4-BW1
tCES tCEH
CE1
tCES tCEH
CE2
tCES tCEH
CE3
tOEQ tOEHZ
OE
tOELZ tOEQX
DATAOUT
High-Z
tKQLZ tKQ
1a
tKQX tKQHZ
DATAIN
High-Z
tZZS tZZREC
ZZ
Single Read
Snooze with Data Retention
Read
15
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01
IS61LV632A
ORDERING INFORMATION Commercial Range: 0C to +70C
Speed (ns) 4 4 5 5 6 6 7 7 8 8 Order Part Number IS61LV632A-4TQ IS61LV632A-4PQ IS61LV632A-5TQ IS61LV632A-5PQ IS61LV632A-6TQ IS61LV632A-6PQ IS61LV632A-7TQ IS61LV632A-7PQ IS61LV632A-8TQ IS61LV632A-8PQ Package TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP
ISSI
(R)
Industrial Range: -40C to +85C
Speed (ns) 6 6 7 7 8 8 Order Part Number IS61LV632A-6TQI IS61LV632A-6PQI IS61LV632A-7TQI IS61LV632A-7PQI IS61LV632A-8TQI IS61LV632A-8PQI Package TQFP PQFP TQFP PQFP TQFP PQFP
ISSI
(R)
Integrated Silicon Solution, Inc.
2231 Lawson Lane Santa Clara, CA 95054 Tel: 1-800-379-4774 Fax: (408) 588-0806 E-mail: sales@issi.com www.issi.com
16
Integrated Silicon Solution, Inc. -- 1-800-379-4774
Rev. A 04/17/01


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